Process Engineer

Job Summary:

We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment.

Key Responsibilities:

Process Engineering & Manufacturing Support

·       Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.

·       Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.

·       Monitor and analyse process data to identify trends, risks, and improvement opportunities.

·       Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.

·       Drive permanent corrective and preventive actions to resolve chronic process and quality issues.

·       Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.

·       Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

·       Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.

·       Prepare production lines and process documentation for internal and external audits.

·       Support audit follow-up actions and ensure timely closure of findings.

·       Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

·       Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.

·       Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.

·       Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications:

·       Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.

·       Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.

·       Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies:

·       Strong data analysis, problem-solving, and critical thinking skills.

·       Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.

·       Good planning, organization, and follow-up skills.

·       Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.

·       Proficiency in Microsoft PowerPoint, Excel, and Word.

·       Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile:

·       A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.

·       Able to adapt to changing priorities while maintaining focus on safety, quality, delivery, and continuous improvement.